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Lithuanian research centre specialising in selective surface activation induced by laser ir seeking a technical or research cooperation partner

Country of Origin: Lithuania
Reference Number: TOLT20180110001
Publication Date: 22 January 2018

Summary

The research center from Lithuania is looking for electronics companies who are interested in molded interconnect devices or electronics on glass surfaces. The center can offer new cost effective (comparing with state of the art) technology for circuit traces formation on both plastic and glass surface. The right partner is sought for a technical cooperation, research cooperation or license agreement.

Description

The research center is carrying out a unique fundamental research and technological development works in scientific fields of laser technologies, optoelectronics, nuclear physics, organic chemistry, bio and nanotechnologies, electrochemical material science, functional materials, electronics, etc. in Lithuania.
Fabrication of circuit traces is the most challenging task in moulded interconnect devices production, being both technically difficult to achieve and difficult to make cost effectively. Addressing this issue company has developed the selective surface activation induced by laser is a new technology for writing electronic circuits directly onto polymers by modifying surface p/roperties with a laser. Moulded interconnect devices – an injection-moulded thermoplastic part with integrated electronics – offers material, weight and cost savings by integrating electronic circuits directly into polymeric components. Lasers can write the circuits directly by modifying the surface of polymers followed by an electroless metal plating. Selective surface activation induced by laser is a three-step process: the first is surface modification by laser; second is chemical activation of modified areas; and the last step is metal deposition by electroless plating. The new technology offers laser writing speeds of up to 4m/s, and therefore spatial plating pitch is kept narrow at 25µm.
The technology is focused on electronical application and can be applied to the automotive, medical, telecommunication industries and consumer products.
The company offering this technology is looking for a research partners, who would like to collaborate on a project using this technology. Other type of agreements technology licensing or technocal assistance agreement would also be considered providing this would be a basis utilizing the technology and using companies expertise.

Advantages and Innovations

Selective surface activation induced by laser offer cost effective plating method of polymers. Currently state of the art of Moulded interconnect devices traces production is Laser direct structuring  technology, which is capable metalized only plastic with special dopants (additives) necessary for the plating process. These additives increase the price of the material at least 3 times. Selective surface activation induced by laser technology can be applied for standard plastics without any special additives. Thus, suggested technique reduces processing costs by at least three times compared with the current technology used in industry.
The additives used in LDS technology is based on metal compounds. Metal based additives limit moulded interconnect devices application for radio frequency devices, thus selective surface activation induced by laser technology gains benefits in radio frequency applications.
Another advantage of selective surface activation induced by laser technology against state of the art is that the mechanical properties of the plastic materials remain not affected by huge amount of special additives.

Stage Of Development

Available for demonstration

Requested partner

Industries or researchers that are electronics developers and manufacturers or other hi-tech sector companies are sought.
Company is seeking an opportunity to develop a partnership under the technical or research cooperation agreement working as a partner on a specific project that would like to adopt this technology. Alternatively company is happy to develop partnership under the license agreement for the technology.

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